Lugar del origen
Guangdong, China
Marca
Electrically neutral thermal path in raised
Tamaño del agujero mín.
0.25mm
Acabado de la superficie
ENIG OSP HAL Leadfree
Dielectric layer thickness
120UM
Thermal conductivity
200 W/M.K
Thermal resistivity
0.015℃/W
Application
Automotive, Stage Lamp, Medical, High Power Lighting
Board Outline Tolerance
± 0.10mm
Out Layer Copper Thickness
18um-350mm
Inner Layer Copper Thickness
17um-210mm
LPI
ISO9001, ISO16949, ROHS